SK hynix breaks ground in West Lafayette; >$4B HBM packaging plant aims for cleanroom by Oct. 2028
SK hynix held a groundbreaking in West Lafayette, Indiana on August 27, 2026, for an advanced-packaging facility for High Bandwidth Memory with a reported investment of more than $4 billion, a cleanroom scheduled for October 2028 and mass production targeted in the second half of 2029.
SK hynix said it held a groundbreaking ceremony in West Lafayette, Indiana on August 27, 2026, to begin construction of an advanced-packaging plant for HBM. The company said wafers from its Korea operations will be shipped to Indiana for local packaging and testing, and that it will build an on-site R&D testbed and has signed a research pact with Purdue University.
According to SK hynix, the project is expected to require more than $4 billion in investment, to staff roughly 1,000 people during commercial operations and to create about 7,000 direct and indirect roles across construction and operation. The company said a cleanroom is scheduled to open by October 2028 and mass production is targeted for the second half of 2029; local and federal officials attended the ceremony.
BusinessIndy examines this development and its implications for Indiana businesses and communities using the linked sources.
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