Purdue’s PARI signs MOU with Lockheed Martin to expand defense tech collaboration, boosting Indiana research and talent pipeline
On Sept. 17, 2026, the Purdue Applied Research Institute (PARI) and Lockheed Martin signed a memorandum of understanding to broaden collaboration in defense technologies including hypersonics, propulsion, energetic materials, advanced manufacturing, cybersecurity, autonomous systems and microelectronics. The agreement aims to deepen joint research, technology development and workforce training.

On Sept. 17, 2026, the Purdue Applied Research Institute (PARI) and Lockheed Martin signed a memorandum of understanding to broaden collaboration in defense technologies. Signatories included Purdue interim President Mitch Daniels; PARI executive vice president Dan DeLaurentis; and Lockheed Martin leaders Tim Cahill and Craig Martell. The MOU lists hypersonics, rocket and aerospace propulsion, energetic materials, advanced manufacturing, cybersecurity, autonomous systems and microelectronics as mutual areas of interest.
The agreement expands on a master research agreement that began in January 2021 and is intended to support joint research, technology development and workforce training. Purdue and PARI highlighted facilities available to Lockheed Martin, including PARI’s Hypersonics and Applied Research Facility and its Hypersonics Advanced Manufacturing Technology Center, two wind tunnels (a Mach 8 quiet tunnel and the HYPULSE reflected shock/expansion tunnel), the Maurice J. Zucrow Laboratories and the Birck Nanotechnology Center. The PARI Scholars Program offers undergraduates immersive research experiences, including opportunities to gain security clearance.
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Source date recorded as September 17, 2026 at 9:37 PM EDT. A sourced news brief; no independent staff reporting is implied. Prepared with AI assistance; source-dependent claims remain attributed in the article.
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