Purdue signs Sept. 18 MOU with UIUC to form joint semiconductor workforce initiative

Purdue and the U. of I. signed the MOU on Sept. 18, 2026 to establish a coordinated semiconductor workforce initiative targeting sectors such as fabrication plants, equipment and materials, chip design, engineering, verification and testing, and advanced packaging. The effort is intended to serve as a single point of engagement for industry partners seeking a trained talent pipeline from both schools.

The universities said the initiative will build on existing programs at both schools and explore joint program formats including experiential learning and expanded industry-focused graduate offerings. Purdue and UIUC plan to jointly hold recruiting and research events in Indiana and Illinois. The leadership team includes Shaloo Rakheja (U. of I.) and Purdue’s David Janes, and the partners said a third person will be appointed as executive director.

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